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Heterogeneously Integrated InP Electro-Absorption Modulator for Beyond 300 Gb/s Optical Links
Keysight Technologies GmbH, Böblingen, 71034, Germany, Riga Technical University, Institute of Photonics, Electronics and Telecommunications, Riga, 1048, Latvia.
OpenLight Photonics, Goleta, 93117, CA, United States.
Riga Technical University, Institute of Photonics, Electronics and Telecommunications, Riga, 1048, Latvia.
OpenLight Photonics, Goleta, 93117, CA, United States.
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2025 (English)In: Journal of Lightwave Technology, ISSN 0733-8724, E-ISSN 1558-2213, Vol. 43, no 4, p. 1826-1836Article in journal (Refereed) Published
Abstract [en]

The recent AI boom requires more focus on energy-efficient and scalable optical interconnects. Silicon Photonics is enabling technology to satisfy growing demand. However, the lack of lasers and high-performance modulators hinders wide-scale adoption. Therefore, we present a heterogeneously integrated Indium Phosphide electro-absorption modulator with Silicon waveguides. We demonstrate up to 256 Gb/s on-off keying, 340 Gb/s 4-level pulse amplitude modulation, 375 Gb/s 6-level pulse amplitude modulation, and 360 Gb/s 8-level pulse amplitude modulation transmission over 500 m and 6 km of single-mode fiber with performance satisfying requirements of 6.25% overhead hard-decision forward error correction threshold of 4.5×10-3. Additionally, we investigate the modulator at 200 Gb/s per lane scenarios, demonstrating excellent performance with a simple seven-tap feed-forward equalizer.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2025. Vol. 43, no 4, p. 1826-1836
Keywords [en]
200 Gb/s per lane, electro-absorption modulator, heterogeneous integration, optical interconnects, silicon photonics, Chirp modulation, Forward error correction, Light modulation, Light modulators, Optical fiber communication, Optical heterodyning, Optical links, Optical signal processing, Photonic integrated circuits, Photonic integration technology, Pulse amplitude modulation, Pulse code modulation links, Semiconducting indium phosphide, Signal modulation, Silicon on insulator technology, Silicon wafers, 200a gb/s per lane, Electroabsorption modulator(EAM), Energy efficient, InP, Optical interconnect, Optical-, Performance, Pulse amplitude, Single mode fibers
National Category
Telecommunications Atom and Molecular Physics and Optics
Identifiers
URN: urn:nbn:se:ri:diva-79502DOI: 10.1109/JLT.2025.3526822Scopus ID: 2-s2.0-85214878866OAI: oai:DiVA.org:ri-79502DiVA, id: diva2:2018472
Note

Article; Granskad

Available from: 2025-12-03 Created: 2025-12-03 Last updated: 2025-12-03Bibliographically approved

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Pang, Xiaodan

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