The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies Number of Authors: 242023 (English)In: 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 - Proceedings, Institute of Electrical and Electronics Engineers Inc. , 2023Conference paper, Published paper (Refereed)

Abstract [en]

We propose a novel co-packaged optical transceiver architecture capable of operating at 112 Gbaud per lane and scalable to 1.6 Tb/s capacity and beyond for next generation 51.2T and 102.4T digital switches. 

Place, publisher, year, edition, pages

Institute of Electrical and Electronics Engineers Inc. , 2023.

Keywords [en]

Photonics, Cointegration, Datacenter, Digital switch, Electronic technologies, Photonics technology, Terabit, Transceiver architecture, Optical switches

National Category

Communication Systems

Identifiers

URN: urn:nbn:se:ri:diva-66080DOI: 10.23919/OFC49934.2023.10116407Scopus ID: 2-s2.0-85161287168ISBN: 9781957171180 (electronic)OAI: oai:DiVA.org:ri-66080DiVA, id: diva2:1791182

Conference

2023 Optical Fiber Communications Conference and Exhibition, OFC 2023. San Diego, USA. 5 May 2023 through 9 May 2023

Note

This work is funded by the H2020 ICT TWILIGHT project (contract No. 781471) under the Photonics PPP.

Available from: 2023-08-24 Created: 2023-08-24 Last updated: 2025-09-23Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Ozolins, OskarsPang, Xiaodan

Search in DiVA

By author/editor

Ozolins, OskarsPang, Xiaodan

By organisation

Industrial Systems

On the subject

Communication Systems

Search outside of DiVA

GoogleGoogle ScholarTotal: 50 hits