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The effect of cyclic moisture and temperature on mould growth onwood compared to steady state conditions
RISE, SP – Sveriges Tekniska Forskningsinstitut.ORCID iD: 0000-0003-0200-6513
RISE, SP – Sveriges Tekniska Forskningsinstitut.ORCID iD: 0000-0001-7930-8654
RISE, SP – Sveriges Tekniska Forskningsinstitut.
2013 (English)In: Building and Environment, ISSN 0360-1323, E-ISSN 1873-684X, Vol. 65, p. 178-184Article in journal (Refereed) Published
Abstract [en]

Moisture and temperature are the two key environmental parameters that determine the possibility of mould growth on building materials. The time that the material is exposed to these elements is also crucial. The natural environmental conditions of relative humidity and temperature are seldom constant over prolonged time periods in a building. Instead, they vary over time, with fungi encountering both favourable and unfavourable conditions; such variable conditions affect mould growth. This paper reports findings from a laboratory study in which mould growth at alternating RH (between 90% and 60%) or temperature conditions (between 22°C and 5°C) was studied and compared to steady state conditions. Fluctuating RH led to slower mould growth, and when the period of unfavourable/favourable conditions was longer (1 week), growth was affected more than if the duration of these conditions was short (12h). When alternating the temperature weekly between 22°C and 5°C, with a mean of 13°C, the mould growth rate was lower compared to when the temperature was held constant at 22°C.

Place, publisher, year, edition, pages
2013. Vol. 65, p. 178-184
Keywords [en]
Fungi, Moisture, Mould, Relative humidity, Stress, Environmental conditions, Environmental parameter, Laboratory studies, Relative humidity and temperatures, Steady-state condition, Temperature conditions, Time-periods, Variable conditions, Atmospheric humidity, Stresses, Molds, construction material, environmental factor, experimental study, fungus, growth rate, laboratory method, moisture flux, parameterization, temperature effect
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:ri:diva-48686DOI: 10.1016/j.buildenv.2013.04.004Scopus ID: 2-s2.0-84877792493OAI: oai:DiVA.org:ri-48686DiVA, id: diva2:1468794
Available from: 2020-09-18 Created: 2020-09-18 Last updated: 2025-09-23Bibliographically approved

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Johansson, PernillaBok, Gunilla

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