The paper presents a comparative analysis between a single side cooled (SSC) power module (PM) and two double side cooled (DSC) PMs - a flip-chip and a non-flip-chip arrangements. These three PM layouts are compared in terms of footprint size, parasitic capacitance, stray inductance, thermal impedance, switching performance, and power loss under the same conditions. The results indicate that the SSC PM has the lowest parasitic capacitance and inductance, whereas the flip-chip DSC PM has the highest power density (smallest footprint), and despite that it has the lowest thermal impedance. Overall, the non-flip-chip DSC PM has the least favorable characteristics among the three layouts.