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Multiphysics Characterization of a Novel SiC Power Module
RISE - Research Institutes of Sweden, ICT, Acreo.
KTH Royal Institute of Technology, Sweden.
RISE - Research Institutes of Sweden, Material och produktion, KIMAB.
Jönköping University, Sweden.
Vise andre og tillknytning
2019 (engelsk)Inngår i: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 9, nr 3, s. 489-501Artikkel i tidsskrift (Fagfellevurdert) Published
Abstract [en]

This paper proposes a novel power module concept specially designed for highly reliable silicon carbide power devices for medium- and high-power applications. The concept consists of two clamped structures: 1) a press-pack power stage accommodating silicon carbide power switch dies, and 2) perpendicularly clamped press-pack heatsinks, in which, the heatsinks are in contact with electrically insulated case plates of the power stage. The concept enables bondless package with symmetric double-sided cooling of the dies and allows for an order of magnitude higher clamping force on the heatsinks than what can be applied on the dies. The concept has been evaluated in a first demonstrator (half-bridge configuration with ten paralleled silicon carbide dies in each position). Experimental methodologies, setups, and procedures have been presented. The commutation loop inductance is approximately 9 nH at 78 kHz. The junction-to-case thermal resistance is approximately 0.028 K/W. Furthermore, a simplified 3D finite element thermomechanical model representing the center unit of the demonstrator, has been established for the purpose of future optimization. The accuracy of the simulated temperatures is within 4 % compared to the measurements. Finally, a 3D thermomechanical stress distribution map has been obtained for the simplified model of the demonstrator.

sted, utgiver, år, opplag, sider
2019. Vol. 9, nr 3, s. 489-501
Emneord [en]
Force, Clamps, Insulation, Silicon carbide, Heat sinks, Friction, Thermal resistance, Computational fluid dynamics, electromagnetic analysis, finite element analysis, inductance, measurement techniques, power electronics, power electronics packaging, press-pack technology, thermomechanical simulation.
HSV kategori
Identifikatorer
URN: urn:nbn:se:ri:diva-35247DOI: 10.1109/TCPMT.2018.2873231OAI: oai:DiVA.org:ri-35247DiVA, id: diva2:1255952
Tilgjengelig fra: 2018-10-15 Laget: 2018-10-15 Sist oppdatert: 2019-07-01bibliografisk kontrollert

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