Within SUW – The International Development Group for Corrugated Board, high class corrugated board research has been conducted since 1968. During the last decade one research focus has been on the heat and moisture transfer in the corrugator. Simulation programs for the single facer and for the double backer were written. Consequences of different operating strategies for the heating table were evaluated. It was shown that for double board, a decreasing temperature along the heating table gives a higher temperature of the middle glue line. Mechanisms for heat transport through the corrugated board paper layers have also been investigated. It was shown that moisture transports a considerable amount of heat through the board. Right now a project is on-going where the levelling out of temperature and moisture in the corrugated stack after corrugated board production will be simulated.SUW´s other research focus, also on-going for a decade, is dealing with the gluability of corrugated board. Still the gluing process in corrugated board production is performed with a starch-water solution. Important gluing parameters like the glue solid content, gluing temperature, gluing time, paper properties and the chemical glue content were investigated. In this project, also the cause of gluing defects was evaluated. For the first time, ”brittle bonding”, a gluing defect in the corrugator, could be simulated. Some results from these simulations will be shown.