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2026 (English) In: ACM Transactions on Software Engineering and Methodology, ISSN 0104-9331, Vol. 35, no 8Article in journal (Refereed) Published
Abstract [en] This article presents a systematic mapping study classifying existing scientific contributions on synergies of Model-Driven Engineering (MDE), AI/Machine Learning (ML), and DevOps, with the overall objective of supporting the continuous development of Cyber-Physical Systems (CPSs). We collected papers from bibliographic sources and selected primary studies to analyze. Then, we characterized and classified the current state of the art, focusing on (1) main aspects already tackled at the intersection of at least two of the three studied areas, and (2) findings emerging from the analysis as a framework for potential future research, notably regarding the integration of the three studied areas. The results reveal that few approaches combine MDE, AI/ML, and DevOps for software and systems engineering. In contrast, several approaches have combined two of them, specifically MDE and DevOps. Approaches combining AI/ML with MDE or DevOps are also becoming more frequent and will most likely continue to progress in the future. These synergies cover a range of engineering activities, from requirements and design to monitoring, maintenance, and evolution. Open research challenges include advancing AI/ML, MDE, and DevOps integration, supporting scalable, data-oriented solutions, proposing new continuous engineering methods, and adapting DevOps practices to diverse systems. © 2026
Place, publisher, year, edition, pages
Association for Computing Machinery (ACM), 2026
Keywords Artificial Intelligence, Cloud Computing, Continuous Integration, Cyber-Physical Systems, DevOps, Internet of Things, Machine Learning, Model-Driven Engineering
National Category
Software Engineering
Identifiers urn:nbn:se:ri:diva-82525 (URN) 10.1145/3759454 (DOI) 2-s2.0-105046008379 (Scopus ID)
Note Funding text: This work was funded by the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL-JU) through the project AIDOaRt, grant agreement No. 101007350, and the Key Digital Technologies Joint Undertaking (KDT-JU) through the project MATISSE, grant agreement No. 101140216.
Funding details: Electronic Components and Systems for European Leadership, ECSEL, (101007350); Chips Joint Undertaking, (101140216)
2026-08-212026-08-212026-08-21 Bibliographically approved