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  • 201.
    Hallbjörner, Paul
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Sánchez-Heredia, Juan Diego
    Martínez-González, Antonio Manuel
    Mode-Stirred Chamber Sample Selection Technique Applied to Antenna Correlation Coefficient2012In: International Journal of Antennas and Propagation, ISSN 1687-5869, E-ISSN 1687-5877, no 2012, p. 986514-Article in journal (Refereed)
  • 202.
    Hallbjörner, Paul
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Ying, Zhinong
    Håkansson, M
    Wingqvist, Claes
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Mätteknik, Kommunikation.
    Anttila, Tommi
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Welinder, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Multipath Simulator for Mobile Terminal Antenna Characterisation2012In: IET Microwaves, Antennas and Propagation, 2012, , p. 743-750Conference paper (Other academic)
  • 203. Hansal, Wolfgang
    et al.
    Sandulache, Gabriela
    Mann, Rudi
    Leisner, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Nickel-phosphorous matrix composites by pulsed electroplating2013In: Electrochemica Acta, Vol. 114, p. 851-858Article in journal (Other academic)
  • 204.
    Hedberg, Johan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Analysis & test of bus systems.2000Report (Refereed)
  • 205.
    Hedberg, Johan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Eriksson, Henrik
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Metoder och tekniker för utveckling av säkerhetskritiska styrsystem i tunga fordon2008Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 206.
    Hedberg, Johan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Eriksson, Henrik
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Tegehall, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Säkerhetskritiska styrsystem i maskiner2009Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 207.
    Hedberg, Johan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Nilsson, Göran
    Analysis & test of bus systems2001Report (Refereed)
  • 208.
    Hedberg, Johan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Söderberg, Andreas
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Tegehall, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    How to design safe machine control systems: a guideline to EN ISO 13849-12011Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 209.
    Hedberg, Johan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Wang, Yingxu
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Methods for Verification and Validation of Distributed Control Systems2001Report (Refereed)
  • 210.
    Hedberg, Johan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Yingxu, Wang
    Methods for verification and validation of distributed control systems.2000Report (Refereed)
  • 211.
    Hedin, Erik
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Strandén, Lars
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Evaluation of FISPAT Fire Spread Analysis Tool2011Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 212.
    Hedin, Erik
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Strandén, Lars
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    FISPAT User Manual2011Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 213.
    Hoffmann, Lars
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Elbilsbränder efter mekanisk påverkan i form av kollision2013Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 214.
    Hoffmann, Lars
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Vattenbegjutning av 400 volts traktionsbatteri i färskvatten och saltvatten2014Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 215.
    Hoffmann, Lars
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Sturk, David
    e-fordons Potentiella Riskfaktorer vid Trafikskadehändelse2013Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 216.
    Hoffmann, Lars
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Söderholm, Tommy
    Elbilsbranden i Ösmo lördagen den 11: e Augusti 20122013Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 217. Hultman, Lars
    et al.
    G. Sarius, Niklas
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Miljötålighet.
    Leisner, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Persson, P.O.A
    Hald, Jens
    Influence of ultrasound and cathode rotation on the formation of intrinsic stress in Ni films during electrodeposition2011In: Transactions of the Institute of Metal Finishing, Vol. 89, no 3, p. 137-142Article in journal (Refereed)
  • 218.
    Hussain, Ahmed
    et al.
    Chalmers University of Technology, Sweden.
    Carlberg, Ulf
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Carlsson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Kildal, Per-Simon
    Chalmers University of Technology, Sweden.
    Analysis of statistical uncertainties involved in estimating ergodic MIMO capacity and diversity gain in rayleigh fading environment2010In: 20 th International Conference on Applied Electromagnetics and Communications. Dubrovnik, Croatia. 2010-09-20--09-23, ICECom 2010 , 2010Conference paper (Refereed)
    Abstract [en]

    Statistical uncertainties involved in the evaluation of ergodic MIMO capacity and diversity gain in a fading environment is investigated. The study is based on results from a numerical simulation tool called "Rayleigh-Lab. " This tool can be used for accuracy investigation of MIMO capacity and diversity gain, and to determine the number of independent samples needed to estimate them with a reasonable level of confidence. The MIMO capacity is evaluated using Shannon's channel capacity formula. Two different methods of evaluating diversity gains are compared: based on CDF curves, and based on estimating correlation and radiation efficiency and then using them in a newly available compact formula for calculating the diversity gain. Rayleigh-Lab emulates Rayleigh channels by generating sequences of random complex numbers and it provides a convenient graphical user-interface for a pedagogical study of average power level (proportional to antenna efficiency), correlation, diversity gain and maximum available capacity.

  • 219.
    Hussain, Ahmed
    et al.
    Chalmers University of Technology, Sweden.
    Kildahl, Per-Simon
    Chalmers University of Technology, Sweden.
    Carlberg, Ulf
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Carlsson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Correlation between far-field patterns on both sides of the head of two-port antenna on mobile terminal2013In: ISAP 2013 - Proceedings of the 2013 International Symposium on Antennas and Propagation., 2013, Vol. 1, p. 288-289p. 288-289Conference paper (Refereed)
    Abstract [en]

    We present an electromagnetic simulation of a practical mobile terminal with a two-port MIMO antenna on left and right sides of the head. The computed far-field patterns include the effect of head and hand phantoms. We show that the far-field patterns on the two sides are strongly correlated if they are presented in the coordinate system of the phone, but they are completely uncorrelated in the coordinate system of the environment.

  • 220.
    Hussain, Ahmed
    et al.
    Chalmers University of Technology, Sweden.
    Kildal, Per-Simon
    Chalmers University of Technology, Sweden.
    Carlberg, Ulf
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Carlsson, Jan
    Chalmers University of Technology, Sweden.
    Diversity gains of multiport mobile terminals in multipath for talk positions on both sides of the head2013In: 7th European Conference on Antennas and Propagation, EuCAP 2013, 2013, , p. 863-866p. 863-866, article id 6546404Conference paper (Refereed)
    Abstract [en]

    The paper studies the over-the-air (OTA) performance of a mobile terminal. A practical two-port mobile terminal model on the left side and the right side of the head for both standard cheek position and standard tilt position is used to study the diversity gains. The diversity gain has been determined by measurements in a reverberation chamber as well as by simulations using the far field patterns from CST Microwave Studio, and then exposing these patterns to rich isotropic multipath (RIMP) environment in a ray-based simulation tool.

  • 221.
    Hérard, Jacques
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Machine control systems. - Safety life cycle and probability. Guidelines for system validation2002Report (Refereed)
    Download full text (pdf)
    fulltext
  • 222.
    Hérard, Jacques
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Guideline for the validation of functional safety according til IEC 615082000Report (Refereed)
  • 223. Islam, Mafijul
    et al.
    Sangchoolie, Behrooz
    Ayatolahi, Fatemeh
    Skarin, Daniel
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Vinter, Jonny
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Törner, Fredrik
    Käck, Andreas
    Nyberg, Mattias
    Villani, Emilia
    Haraldsson, Johan
    Isaksson, Patrik
    Karlsson, Johan
    Towards Benchmarking of Functional Safety in the Automotive Industry2013In: 14th European Workshop on Dependable Computing, EWDC 2013, 2013, , p. 111-125Conference paper (Refereed)
  • 224.
    Jacobson, J
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    IEC 61496: A safety standard for electrosensitive protective devices.1999In: Compliance engineering, ISSN 0898-3577, no 2, p. 50-56Article in journal (Other academic)
  • 225.
    Jacobson, J
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Validation of the functional safety of programmable electronic systems (PES) - framework.: Nordtest project 1355-971999Report (Refereed)
  • 226.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Informationssäkerhet i fjärravlästa elmätare.1994Report (Refereed)
    Download full text (pdf)
    fulltext
  • 227.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Kan man visa om en maskinstyrning är säker?2000Report (Refereed)
    Download full text (pdf)
    fulltext
  • 228.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Safety validation of computer-based machine control systems.1997Report (Refereed)
    Download full text (pdf)
    fulltext
  • 229.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Software controlled medical devices.1997Report (Refereed)
    Download full text (pdf)
    fulltext
  • 230.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Säkerhet i datorbaserade maskinstyrningar.1995Report (Refereed)
    Download full text (pdf)
    fulltext
  • 231.
    Jacobson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Utvärdering av programvarustyrda apparater.1992Report (Refereed)
    Download full text (pdf)
    fulltext
  • 232.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Emardson, Ragne
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Mätteknik, Kommunikation.
    Eriksson, Henrik
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Hérard, Jacques
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Steinmetz, Erik
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Mätteknik, Kommunikation.
    En forskningsinfrastruktur för AstaZero: förstudie2011Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 233.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Eriksson, Henrik
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    En forskningsplan för AstaZero2012Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 234.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Eriksson, Henrik
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Janevik, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, AstaZero.
    Andersson, Håkan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, AstaZero.
    How Is AstaZero Designed and Equipped for Active Safety Testing?2015Article in journal (Other academic)
  • 235.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Grante, Christian
    Functional Safety in Systems of Road Vehicles2010Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 236.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Hérard, Jacques
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Eriksson, Henrik
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Active Safety in Road Vehicles - Developing Testing and Evaluation Methods for ICT-Based Safety Systems2009In: 16th World congress and Exhibition on Intelligent Transport Systems and Services. Stockholm. 2009-09-21--25, 16th World congress and Exhibition on Intelligent Transport Systems and Services , 2009Conference paper (Refereed)
  • 237.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Johansson, Lars-Åke
    Lundin, Magnus
    RISE, SP – Sveriges Tekniska Forskningsinstitut.
    Safety of distributed machine control systems.1996Report (Refereed)
    Download full text (pdf)
    fulltext
  • 238.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Kjell, Gunnar
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Sveriges tekniska forskningsinstitut, SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh).
    Lau, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Mätteknik, Volym, flöde, temperatur o densitet.
    Tunare, Jens
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Åkesson, Eddie
    ?.
    Programvarukvalitet i mät- och provutrustning.1993Report (Refereed)
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    fulltext
  • 239.
    Jacobson, Jan
    et al.
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Söderberg, Andreas
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Johansson, Lars-Åke
    Lönn, Henrik
    Safety requirements and validation methods for safety-related automotive electronics2007Report (Refereed)
    Download full text (pdf)
    FULLTEXT01
  • 240.
    Jacobsson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Machinery: Validation of safety principles in safety-related parts of electronic systems2000Report (Refereed)
  • 241.
    Jacobsson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Produktsäkerhet.
    Validation of the functional safety of programmable electronic systems (PES): Framework.2000Report (Refereed)
  • 242. Jamaly, Nima
    et al.
    Carlsson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Kildal, Per-Simon
    Multipath Emulator for Simulation of Wireless Terminals' Performance2011In: GigaHertz symposium. Lund. 2010-03-09--10, 2011Conference paper (Refereed)
  • 243. Jamaly, Nima
    et al.
    Kildal, Per-Simon
    Carlsson, Jan
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Performance of Directive Multi-element Antennas versus Multi-beam Arrays in MIMO Communication Systems2011In: 4 th. European Conference on Antennas and Propagation. Barcelona, Spain. 2010-04-12--16, EuCAP , 2011Conference paper (Refereed)
  • 244. Jobs, Magnus
    et al.
    Lantz, Fredrik
    Lewin, Britta
    Jansson, Erik
    Antoni, Jonas
    Brunberg, Kjell
    Hallbjörner, Paul
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, EMC.
    Rydberg, Anders
    WBAN MASS: A WBAN-based Monitoring Application SyStem2009Conference paper (Refereed)
  • 245. Johansson, J.
    et al.
    Leisner, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Prognostics of Thermal Fatigue Failure of Solder Joints in Avionic Equipment2012In: IEEE Aerospace and Electronic Systems Magazine, ISSN 0885-8985, E-ISSN 1557-959X, Vol. 27, no 4, p. 16-24Article in journal (Refereed)
  • 246. Johansson, J
    et al.
    Leisner, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Johnson, Erland
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Sveriges tekniska forskningsinstitut, SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh).
    Belov, Ilja
    An approach to life consumption monitoring of solder joints in operating temperature environment2012Conference paper (Refereed)
  • 247.
    Johansson, Jonas
    et al.
    Saab, Sweden; Jönköping University, Sweden.
    Belov, Ilja
    Jönköping University, Sweden.
    Johnson, Erland
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Sveriges tekniska forskningsinstitut, SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh).
    Dudek, Rainer
    Fraunhofer, Germany.
    Leisner, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
    Investigation on thermal fatigue of SnAgCu, Cu100C, and SnPbAg solder joints in varying temperature environments2014In: Microelectronics Reliability, Vol. 54, no 11, p. 2523-2535Article in journal (Refereed)
    Abstract [en]

    Thermal cycling tests have been performed for a range of electronic components intended for avionic applications, assembled with SAC305, SN100C and SnPbAg solder alloys. Two temperatureprofiles have been used, the first ranging between -20 °C and +80 °C (TC1), and the second between -55 °C and +125 °C (TC2). High level of detail is provided for the solder alloy composition and the component package dimensions, and statistical analysis, partially supported by FE modeling, is reported. The test results confirm the feasibility of SAC305 as a replacement for SnPbAg under relatively benign thermomechanical loads. Furthermore, the test results serve as a starting point for estimation of damage accumulation in a critical solder joint in field conditions, with increased accuracy by avoiding data reduction. A computationally efficient method that was earlier introduced by the authors and tested on relatively mild temperature environments has been significantly improved to become applicable on extended temperature range, and it has been applied to a PBGA256 component with SAC305 solder in TC1 conditions. The method, which utilizes interpolated response surfaces generated by finite element modeling, extends the range of techniques that can be employed in the design phase to predict thermal fatigue of solder joints under field temperatureconditions.

  • 248.
    Johansson, Jonas
    et al.
    Saab, Sweden.
    Belov, Ilja
    Jönköping University, Sweden.
    Johnson, Erland
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Sveriges tekniska forskningsinstitut, SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh).
    Leisner, Peter
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik. Jönköping University, Sweden.
    A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads2014In: Engineering computations, ISSN 0264-4401, E-ISSN 1758-7077, Vol. 31, no 3, p. 467-489, article id 17110717Article in journal (Refereed)
    Abstract [en]

    Purpose-The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature environment. A procedure to implement the method is suggested, and a discussion of the method and its possible applications is provided in the paper. Design/methodology/approach- Methodologically, interpolated response surfaces based on specially designed finite element (FE) simulation runs, are employed to compute a damage metric at regular time intervals of an operating temperature profile. The developed method has been evaluated on a finite-element model of a lead-free PBGA256 package, and accumulated creep strain energy density has been chosen as damage metric. Findings-The method has proven to be two orders of magnitude more computationally efficient compared to FE simulation. A general agreement within 3 percent has been found between the results predicted with the new method, and FE simulations when tested on a number of temperature profiles from an avionic application. The solder joint temperature ranges between +25 and +75 °C. Practical implications-The method can be implemented as part of reliability assessment of electronic packages in the design phase. Originality/value-The method enables increased accuracy in thermal fatigue life prediction of solder joints. Combined with other failure mechanisms, it may contribute to the accuracy of reliability assessment of electronic packages.

  • 249.
    Johansson, Rolf
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Brief announcement: KARYON2012In: 14th International Symposium on Stabilization, Safety, and Security of Distributed Systems, SSS 2012, 2012, , p. 232-235Conference paper (Refereed)
  • 250.
    Johansson, Rolf
    RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik, Pålitliga system.
    Integrated safety and architecture modeling for automotive embedded systems2011In: Elektrotechnik und Informationstechnik, ISSN 0932-383X, Vol. 128, no 6, p. 196-202Article in journal (Refereed)
2345678 201 - 250 of 407
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