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  • 1. Bring, M
    et al.
    Sanz-Velasco, A
    Rodjegard, H
    RISE, Swedish ICT, SICS, Imego.
    Enoksson, P
    Micro pinball game demonstrating an easy MEMS transfer process using room temperature plasma bonding,2003In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 13, no 4, p. s51-61Article in journal (Refereed)
  • 2. Elderstig, H
    et al.
    Larsson, O
    RISE, Swedish ICT, Acreo.
    Polymeric MST - high precision at low cost1999In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 7, no 3Article in journal (Refereed)
  • 3.
    Forsberg, Fredrik
    et al.
    KTH Royal Institute of Technology, Sweden.
    Fischer, Andreas C.
    KTH Royal Institute of Technology, Sweden.
    Roxhed, Niclas
    KTH Royal Institute of Technology, Sweden.
    Samel, Björn
    RISE, Swedish ICT, Acreo.
    Ericsson, Per
    RISE, Swedish ICT, Acreo.
    Stemme, Göran N.
    KTH Royal Institute of Technology, Sweden.
    Niklaus, Frank
    KTH Royal Institute of Technology, Sweden.
    Heterogeneous 3D integration of 17 μm pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems2013In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 23, no 4, article id 045017Article in journal (Refereed)
    Abstract [en]

    This paper reports on the realization of 17 μm × 17 μm pitch bolometer arrays for uncooled infrared imagers. Microbolometer arrays have been available in primarily defense applications since the mid-1980s and are typically based on deposited thin films on top of CMOS wafers that are surface-machined into sensor pixels. This paper instead focuses on the heterogeneous integration of monocrystalline Si/SiGe quantum-well-based thermistor material in a CMOS-compliant process using adhesive wafer bonding. The high-quality monocrystalline thermistor material opens up for potentially lower noise compared to commercially available uncooled microbolometer arrays together with a competitive temperature coefficient of resistance (TCR). Characterized bolometers had a TCR of -2.9% K-1 in vacuum, measured thermal conductances around 5 × 10-8 W K-1 and thermal time constants between 4.9 and 8.5 ms, depending on the design. Complications in the fabrication of stress-free bolometer legs and low-noise contacts are discussed and analyzed.

  • 4. Najmzadeh, M
    et al.
    Hassl, S
    RISE, Swedish ICT, SICS, Imego.
    Enoksson, P
    A silicon straight tube fluid density sensor2007In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 17, p. 1657-63Article in journal (Refereed)
  • 5.
    Olsson, A
    et al.
    RISE, Swedish ICT, Acreo.
    Stemme, G
    Stemme, E
    A numerical design study of the valveless diffuser pump using a lumped-mass model1999In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 9, p. 34-Article in journal (Refereed)
  • 6.
    Rusu, C
    et al.
    RISE, Swedish ICT, Acreo.
    Persson, K
    RISE, Swedish ICT, Acreo.
    Ottosson, B
    Billger, D
    LTCC interconnects in Microsystems2013In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 16, no 6, p. 13-18Article in journal (Refereed)
  • 7. Rödjegård, H
    et al.
    Andersson, G I
    RISE, Swedish ICT, Acreo.
    Löfgren, M
    Rusu, C
    RISE, Swedish ICT, Acreo.
    Billger, D
    Capacitive slanted-beam three-axis accelerometer, Part 1: Modelling design2005In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 15, p. 1989-96Article in journal (Refereed)
  • 8. Rödjegård, H
    et al.
    Andersson, G I
    RISE, Swedish ICT, Acreo.
    Löfgren, M
    Rusu, C
    RISE, Swedish ICT, Acreo.
    Billger, D
    Capacitive slanted-beam three-axis accelerometer, Part 2: Characterisation2005In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 15, p. 1997-2002Article in journal (Refereed)
  • 9. Sanz-Velasco, A
    et al.
    Rödjegård, H
    RISE, Swedish ICT, SICS, Imego.
    Andersson, GI
    Double sided bulk micromachining of SOI films using room temperature oxygen plasma assisted bonding2002In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 12, p. 786-94Article in journal (Refereed)
1 - 9 of 9
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