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Thermo-mechanical simulations and measurements on high temperature interconnections
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-6483-8924
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0003-4860-8763
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-8556-0925
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2011 (English)In: 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011, article id 5765772Conference paper, Published paper (Refereed)
Abstract [en]

In order to place sensors or electronics in very high temperature environments, new materials and methods for interconnection are required. A comparative study between different electrical interconnection methods for very high operation temperatures (500 °C - 800 °C) is presented. Thermo-mechanical simulations and characterization of samples of the interconnection types during high temperature exposure are presented. The results of the thermo-mechanical simulations showed that stresses are low in a connection system based on liquid interconnection. This system, however, proved to be difficult to realize due to problems with oxides and sealing of the metallic liquid. Modeling of an interconnection based purely on mechanical pressure without any solder or metallic bond showed high stress. This was also confirmed during high temperature exposure where the connection failed. High stress was also predicted for an interconnection based on nano-Ag paste. The high temperature tests, however, showed promising results at 800 °C for over 100 hours. © 2011 IEEE.

Place, publisher, year, edition, pages
2011. article id 5765772
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Materials Engineering
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URN: urn:nbn:se:ri:diva-13427DOI: 10.1109/ESIME.2011.5765772Scopus ID: 2-s2.0-79957904848ISBN: 9781457701078 (print)OAI: oai:DiVA.org:ri-13427DiVA, id: diva2:973634
Conference
12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
Available from: 2016-09-22 Created: 2016-09-22 Last updated: 2018-08-20Bibliographically approved

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Andersson, Dag

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Brinkfeldt, KlasAdolfsson, ErikTegehall, Per-ErikAndersson, Dag
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