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Simulations of a high temperature pressure sensor packaging and interconnection
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
Czech Technical University.
Czech Technical University.
Czech Technical University.
Show others and affiliations
2012 (English)In: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012Conference paper, Published paper (Refereed)
Abstract [en]

Modeling and thermal cycling of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961°C). It has shown operational in temperature cycling above 600°C for more than 1800 hours. Modeling of the package show that the stress in the electrical interconnections are close to the yield stress of silver at 20°C. The stress free temperature in the modeling was set to 850°C. Temperature induced stress and strains in the packaging and a fatigue simulation are performed. The package is generic and can be converted to fit most geometries and high temperature applications. © 2012 IEEE.

Place, publisher, year, edition, pages
2012.
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:ri:diva-13422DOI: 10.1109/ESimE.2012.6191730Scopus ID: 2-s2.0-84861394760ISBN: 9781467315128 (print)OAI: oai:DiVA.org:ri-13422DiVA: diva2:973629
Conference
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
Available from: 2016-09-22 Created: 2016-09-22 Last updated: 2017-08-09Bibliographically approved

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