Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Modeling of SiC power modules with double sided cooling
RISE - Research Institutes of Sweden (2017-2019), Materials and Production, IVF.ORCID iD: 0000-0002-6483-8924
Fairchild Semiconductor GmbH, Germany.
RISE - Research Institutes of Sweden (2017-2019), Materials and Production, IVF.
Fairchild Semiconductor GmbH, Germany.
Show others and affiliations
2014 (English)In: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, IEEE Computer Society , 2014, article id 6813864Conference paper, Published paper (Refereed)
Abstract [en]

Silicon Carbide (SiC) based transistor devices have demonstrated higher efficiency switching operation compared to silicon-based, state-of-the-art solutions due to the superior electrical and thermal properties of the SiC material. The improved current density and thermal conductivity allows SiC-based power modules to be smaller than their silicon counterparts for comparable current densities. The active chip area can be reduced further by effectively cooling the devices. In this work, a new power module including SiC bipolar junction transistors (BJT) and diodes and integrated double sided cooling will be introduced. The target application of these modules is a new drive-train system for commercial electric vehicles.

Place, publisher, year, edition, pages
IEEE Computer Society , 2014. article id 6813864
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:ri:diva-13405DOI: 10.1109/EuroSimE.2014.6813864Scopus ID: 2-s2.0-84901422212ISBN: 9781479947904 (print)OAI: oai:DiVA.org:ri-13405DiVA, id: diva2:973612
Conference
2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Available from: 2016-09-22 Created: 2016-09-22 Last updated: 2023-05-25Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopushttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6813864

Authority records

Brinkfeldt, KlasAndersson, Dag

Search in DiVA

By author/editor
Brinkfeldt, KlasAndersson, Dag
By organisation
IVF
Materials Engineering

Search outside of DiVA

GoogleGoogle Scholar

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 39 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf