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Development of microstructure during creep of polycrystalline mullite and a nanocomposite mullite/5 vol.% SiC
Chalmers University of Technology.
Chalmers University of Technology.
University of Cambridge.
University of Cambridge.
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2009 (English)In: Journal of the European Ceramic Society, ISSN 0955-2219, E-ISSN 1873-619X, Vol. 29, no 4, p. 539-550Article in journal (Refereed) Published
Abstract [en]

The microstructures of as-sintered and creep tested polycrystalline mullite and mullite reinforced with 5 vol.% nano-sized SiC particles have been characterized by scanning and transmission electron microscopy. The dislocation densities after tensile creep testing at 1300 and 1400 °C were virtually unchanged as compared to the as-sintered materials which indicates diffusion-controlled deformation. Mullite matrix grain boundaries bending around intergranular SiC particles suggest that grain boundary pinning, in addition to a reduced mullite grain size, contributed to the increased creep resistance of the mullite/5 vol.% SiC nanocomposite. Both materials showed pronounced cavitation at multi-grain junctions after creep testing at 1400 °C which suggests that unaccommodated grain boundary sliding, facilitated by softening of the intergranular glass, occurred at this temperature. This is consistent with the higher stress exponents at 1400 °C. © 2008 Elsevier Ltd. All rights reserved.

Place, publisher, year, edition, pages
2009. Vol. 29, no 4, p. 539-550
Keywords [en]
Creep, Electron microscopy, Grain boundaries, Mullite, Nanocomposites
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:ri:diva-13381DOI: 10.1016/j.jeurceramsoc.2008.06.036Scopus ID: 2-s2.0-57749196180OAI: oai:DiVA.org:ri-13381DiVA, id: diva2:973587
Available from: 2016-09-22 Created: 2016-09-22 Last updated: 2017-08-09Bibliographically approved

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