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Pressure dependence of thermal contact resistance between copper heat sink and copper DBC surfaces in SiC power device packages
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.ORCID iD: 0000-0002-8712-9899
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.
2014 (English)Conference paper, Published paper (Refereed)
Abstract [en]

Thermal contact resistances have been measured in an experiment emulating heat transfer from a SiC die to a cooled heat sink through a heat spreader and a DBC structure. The major surfacedependent parameters are the surface roughness, surface hardness, and planarity. The measured thermal contact resistances are in agreement with theoretical values. When investigating DBC copper surfaces a second interface between the bonded Cu to AlN has to be taken into account. © (2014) Trans Tech Publications, Switzerland.

Place, publisher, year, edition, pages
Trans Tech Publications Ltd , 2014. Vol. 778-780, p. 1118-1121
Series
Materials Science Forum, ISSN 0255-5476
Keywords [en]
Cooling, DBC, Heat transfer, Packaging, Planarity, Pressure dependence, SiC, Surface parameter, Surface roughness, Thermal contact resistance
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:ri:diva-12920DOI: 10.4028/www.scientific.net/MSF.778-780.1118ISBN: 9783038350101 (print)OAI: oai:DiVA.org:ri-12920DiVA, id: diva2:973113
Conference
15th International Conference on Silicon Carbide and Related Materials, ICSCRM 2013, Miyazaki, 29 September 2013 through 4 October 2013, 103223
Available from: 2016-09-22 Created: 2016-09-22 Last updated: 2018-07-11Bibliographically approved

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Toth-Pal, Zsolt

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CiteExportLink to record
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