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Pressure dependence of thermal contact resistance between copper heat sink and copper DBC surfaces in SiC power device packages
RISE, Swerea, Swerea KIMAB.
RISE, Swerea, Swerea KIMAB.
2014 (English)Conference paper, Published paper (Refereed)
Abstract [en]

Thermal contact resistances have been measured in an experiment emulating heat transfer from a SiC die to a cooled heat sink through a heat spreader and a DBC structure. The major surfacedependent parameters are the surface roughness, surface hardness, and planarity. The measured thermal contact resistances are in agreement with theoretical values. When investigating DBC copper surfaces a second interface between the bonded Cu to AlN has to be taken into account. © (2014) Trans Tech Publications, Switzerland.

Place, publisher, year, edition, pages
Trans Tech Publications Ltd , 2014. Vol. 778-780, p. 1118-1121
Series
Materials Science Forum, ISSN 0255-5476
Keywords [en]
Cooling, DBC, Heat transfer, Packaging, Planarity, Pressure dependence, SiC, Surface parameter, Surface roughness, Thermal contact resistance
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:ri:diva-12920DOI: 10.4028/www.scientific.net/MSF.778-780.1118ISBN: 9783038350101 (print)OAI: oai:DiVA.org:ri-12920DiVA, id: diva2:973113
Conference
15th International Conference on Silicon Carbide and Related Materials, ICSCRM 2013, Miyazaki, 29 September 2013 through 4 October 2013, 103223
Available from: 2016-09-22 Created: 2016-09-22Bibliographically approved

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