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Investigation of a finned baseplate material and thickness variation for thermal performance of a SiC power module
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.
2014 (English)In: 15th international conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, IEEE , 2014, , p. 1-8Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
IEEE , 2014. , p. 1-8
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Natural Sciences
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URN: urn:nbn:se:ri:diva-12451Local ID: 23636OAI: oai:DiVA.org:ri-12451DiVA, id: diva2:970275
Conference
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014. 15th international conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Ghent
Available from: 2016-09-13 Created: 2016-09-13Bibliographically approved

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CiteExportLink to record
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