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An approach to life consumption monitoring of solder joints in operating temperature environment
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.ORCID iD: 0000-0002-7095-1907
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Sveriges tekniska forskningsinstitut, SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh).ORCID iD: 0000-0001-7182-0872
2012 (English)Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2012.
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Natural Sciences
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URN: urn:nbn:se:ri:diva-12154Local ID: 13993OAI: oai:DiVA.org:ri-12154DiVA, id: diva2:969976
Conference
EuroSime 2012, Cascais, Portugal.
Available from: 2016-09-13 Created: 2016-09-13 Last updated: 2020-12-01Bibliographically approved

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Leisner, PeterJohnson, Erland

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SP ElektronikSP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh)
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CiteExportLink to record
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