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CFD analysis of an avionic module for evaluating power distribution as a thermal management measure for a double-sided PCB
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.ORCID iD: 0000-0002-7095-1907
2007 (English)In: Proc. 23rd Semiconductor thermal measurement and management symposium, SEMI-THERM 23, 2007, , p. 233-243Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2007. , p. 233-243
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Natural Sciences
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URN: urn:nbn:se:ri:diva-11755Local ID: 9001OAI: oai:DiVA.org:ri-11755DiVA, id: diva2:969577
Conference
23rd Semiconductor thermal measurement and management symposium, SEMI-THERM 23 San José , CA, USA March 20-22, 2007
Available from: 2016-09-13 Created: 2016-09-13 Last updated: 2020-12-01Bibliographically approved

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Leisner, Peter

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