System disruptions
We are currently experiencing disruptions on the search portals due to high traffic. We are working to resolve the issue, you may temporarily encounter an error message.
EnglishSvenskaNorsk
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Prognostics of Thermal Fatigue Failure of Solder Joints in Avionic Equipment
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.ORCID iD: 0000-0002-7095-1907
2012 (English)In: IEEE Aerospace and Electronic Systems Magazine, ISSN 0885-8985, E-ISSN 1557-959X, Vol. 27, no 4, p. 16-24Article in journal (Refereed) Published
Place, publisher, year, edition, pages
2012. Vol. 27, no 4, p. 16-24
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-6328DOI: 10.1109/MAES.2012.6203714Scopus ID: 2-s2.0-84861747658Local ID: 13595OAI: oai:DiVA.org:ri-6328DiVA, id: diva2:964165
Available from: 2016-09-08 Created: 2016-09-08 Last updated: 2020-12-01Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Leisner, Peter

Search in DiVA

By author/editor
Leisner, Peter
By organisation
SP Elektronik
In the same journal
IEEE Aerospace and Electronic Systems Magazine
Natural Sciences

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 31 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
v. 2.45.0
|
WCAG