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Analysis of the Performance of Different Packaging Technologies of SiC Power Modules during Power Cycling Test
KTH Royal Institute of Technology, Sweden.
University of Warwick Coventry, UK.
KTH Royal Institute of Technology, Sweden.
RISE Research Institutes of Sweden, Digital Systems, Smart Hardware.ORCID iD: 0000-0002-5027-3491
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2023 (English)In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Institute of Electrical and Electronics Engineers (IEEE), 2023Conference paper, Published paper (Refereed)
Abstract [en]

Commercialization of SiC MOSFETs and electrification of the automotive sector has resulted in the accelerated development of power semiconductor devices. To take the most advantage of the SiC properties and make the power semiconductor modules automotive graded, the power module packaging technologies are developing at a rapid pace. New materials are being introduced and more innovative ways are being investigated to operate the SiC die at high temperatures while maintaining high reliability. Silver (Ag) sinter, due to its superior properties, has been introduced as a state-of-the-art die-attaching technology, while different ways are being investigated to either eliminate the aluminium (Al) bondwires or replace them with copper (Cu) counterparts. In this study, we will use the Finite Element (FE) method to investigate the impact of different packaging aspects like using copper foil and Ag sinter on thermal and mechanical performance of the power module. We will also investigate the effect of different packaging on power module reliability.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2023.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:ri:diva-68558DOI: 10.1109/THERMINIC60375.2023.10325878OAI: oai:DiVA.org:ri-68558DiVA, id: diva2:1819186
Conference
2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Note

The authors would like to acknowledge the Swedish Electromobility Centre and Scania AB for funding this study.

Available from: 2023-12-13 Created: 2023-12-13 Last updated: 2023-12-13Bibliographically approved

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Kostov, Konstantin Stoychev

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