Low-cost dielectric sheets for large-area floor sensing applicationsShow others and affiliations
2022 (English)In: Flexible and Printed Electronics, ISSN 2058-8585, Vol. 7, no 4, article id 045005Article in journal (Refereed) Published
Abstract [en]
Sensitivity response is a critical parameter that decides the domain of dielectric materials to be implemented as piezocapacitive sensors for low- or high-pressure sensing applications. Here, we have clarified the sensitivity response behavior of three low-cost dielectric materials, two biodegradable paperboards, and one acoustic polymeric foam. The devices are fabricated in the form of a metal-insulator-metal structure, and the capacitive response of the devices is measured using the charge extraction by linearly increasing voltage technique. The sensitivity response curve (ΔC/C o vs. pressure) reveals that the paperboard materials are sensitive enough to detect low-pressure regimes (45 kPa), whereas the acoustic foam is quite promising for high-pressure monitoring (above 150 kPa). Using a multiplexer circuit, we demonstrated the sensitivity response via 2 by 2 matrix structure both as a steady-state and transient response. Our results show that the passive matrix structure interference between different pixels can be minimized after increasing the spacing between electrodes strip. Finally, a full-scale demonstrator (dimension 120 cm × 400 cm) with a 2 × 8 matrix structure laminated under floor tiling has been demonstrated. We show how such a floor sensor utilizing the low-cost substrates can be used to recognize single-stepping, walking, and falling.
Place, publisher, year, edition, pages
Institute of Physics , 2022. Vol. 7, no 4, article id 045005
Keywords [en]
biodegrable sheets, capacitance, dielectric, piezocapacitive sensor, sensitivity, Costs, Dielectric materials, Floors, Metal insulator boundaries, Timing circuits, Transient analysis, Biodegrable sheet, Dielectric sheets, High pressure, Low pressures, Low-costs, Low-high, Matrix structure, Sensing applications, Dielectrics, Foam, Materials
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:ri:diva-61364DOI: 10.1088/2058-8585/ac968bScopus ID: 2-s2.0-85140838192OAI: oai:DiVA.org:ri-61364DiVA, id: diva2:1717542
Note
Funding details: Norges Forskningsråd, 282310; Funding text 1: We would like to acknowledge the financial support provided by the Research Council of Norway and the companies supporting the ALLOC project (Grant No. 282310). The authors would like to thank laboratory engineer (retired) Dr Kjell-Mikael Källman for valuable assistance with the equipment setup and measurements issues.
2022-12-082022-12-082023-05-17Bibliographically approved