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Through silicon vias filled with planarized carbon nanotube bundles
Chalmers University of Technology, Sweden;.ORCID iD: 0000-0002-7928-2076
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2009 (English)In: Nanotechnology, ISSN 0957-4484, E-ISSN 1361-6528, Vol. 20, no 48Article in journal (Refereed) Published
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IOP Publishing , 2009. Vol. 20, no 48
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Natural Sciences
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URN: urn:nbn:se:ri:diva-61154DOI: 10.1088/0957-4484/20/48/485203OAI: oai:DiVA.org:ri-61154DiVA, id: diva2:1710410
Available from: 2022-11-13 Created: 2022-11-13 Last updated: 2022-11-23Bibliographically approved

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Lindahl, Niklas

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