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Low temperature chemical sintering of inkjet-printed Zn nanoparticles for highly conductive flexible electronic components
RISE Research Institutes of Sweden, Digital Systems, Smart Hardware.ORCID iD: 0000-0002-7825-9501
RISE Research Institutes of Sweden. Idaho National Laboratory, USA.
RISE Research Institutes of Sweden, Digital Systems, Smart Hardware.
RISE Research Institutes of Sweden, Digital Systems, Smart Hardware.
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2021 (English)In: npj Flexible Electronics, ISSN 2397-4621, Vol. 5, no 1, article id 14Article in journal (Refereed) Published
Abstract [en]

This study illustrates an innovative way to fabricate inkjet-printed tracks by sequential printing of Zn nanoparticle ink and curing ink for low temperature in situ chemical sintering. Employing chemical curing in place of standard sintering methods leads to the advantages of using flexible substrates that may not withstand the high thermal budgets of the standard methods. A general formulation engineering method is adopted to produce highly concentrated Zn ink which is cured by inkjet printing an over-layer of aqueous acetic acid which is the curing agent. The experimental results reveal that a narrow window of acid concentration of curing ink plays a crucial role in determining the electrical properties of the printed Zn nanoparticles. Highly conductive (~105 S m−1) and mechanically flexible printed Zn features are achieved. In addition, from systematic material characterization, we obtain an understanding of the curing mechanism. Finally, a touch sensor circuit is demonstrated involving all-Zn printed conductive tracks. © 2021, The Author(s).

Place, publisher, year, edition, pages
Nature Research , 2021. Vol. 5, no 1, article id 14
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Materials Chemistry
Identifiers
URN: urn:nbn:se:ri:diva-55467DOI: 10.1038/s41528-021-00111-1Scopus ID: 2-s2.0-85109623396OAI: oai:DiVA.org:ri-55467DiVA, id: diva2:1583398
Note

 Funding details: Horizon 2020 Framework Programme, H2020, 814485; Funding text 1: The authors would like to thank the LEE-BED project funded by European Union’s Horizon 2020 research and innovation program under grant agreement number 814485.

Available from: 2021-08-06 Created: 2021-08-06 Last updated: 2024-03-03Bibliographically approved

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Majee, SubimalUl Hassan Alvi, NaveedBeni, ValerioNilsson, David

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