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Molding compounds adhesion and influence on reliability of plastic packages for SiC-based power MOS devices
Consorzio Catania Ricerche, Italy.
Consorzio Catania Ricerche, Italy.
STMicroelectronics, Italy.
STMicroelectronics, Italy.
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2013 (English)In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 3, no 7, p. 1094-1106, article id 6497556Article in journal (Refereed) Published
Abstract [en]

Adhesion and interface compositions of epoxy phenolic molding compounds (EMCs) for high-temperature plastic packages are studied. Interfaces are obtained by molding two EMCs onto aluminum oxide-hydroxide surfaces (oxide onto thin film of AlSiCu) and two die passivation layers consisting of fluorinated polyimide and cyclotene. One compound (A) is a 'green' type, containing organic phosphorous-based flame retardant, and the other compound (B) is a conventional type containing antimony (III) oxide and bromined resin flame retardants. A high-temperature storage test at 250 °C is employed to study chemical modifications occurring at the previously mentioned interfaces. A high-temperature reverse bias test at 225 °C is employed to study the influences of the EMC chemical formulations on the reliability of plastic packages for SiC-based power MOS devices. Green compound A shows poor adhesion onto Al oxide and high adhesion strength onto both polymer passivations. The failure mechanism is mainly cohesive on the polymer passivations. The conventional compound B shows a high degree of delamination because of poor adhesion compared with the green compound. SiC-based power MOS devices assembled in plastic packages with compound A show better reliability under HTRB test at 225 °C compared with compound B.

Place, publisher, year, edition, pages
2013. Vol. 3, no 7, p. 1094-1106, article id 6497556
Keywords [en]
Adhesion, green molding compounds, reliability, scanning acoustic microscopy (SAM), silicon carbide devices, X-ray photoelectron spectroscopy (XPS), Chemical formulation, Fluorinated polyimides, High-temperature storage, Interface composition, Phenolic molding compounds, Scanning Acoustic Microscopy, Chemical modification, Failure (mechanical), Flame retardants, Photoelectrons, Sheet molding compounds, Silicon carbide, X ray photoelectron spectroscopy, Antimony compounds
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:ri:diva-47587DOI: 10.1109/TCPMT.2013.2247466Scopus ID: 2-s2.0-84880573440OAI: oai:DiVA.org:ri-47587DiVA, id: diva2:1463299
Available from: 2020-09-01 Created: 2020-09-01 Last updated: 2024-09-04Bibliographically approved

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Bakowski, Mietek

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