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On the torsion method for measurement of out-of-plane shear properties
RISE - Research Institutes of Sweden, Bioeconomy, Papermaking and Packaging.
RISE - Research Institutes of Sweden, Bioeconomy, Papermaking and Packaging.ORCID iD: 0000-0002-9689-5966
RISE - Research Institutes of Sweden, Bioeconomy, Papermaking and Packaging.ORCID iD: 0000-0003-0848-4305
RISE - Research Institutes of Sweden.ORCID iD: 0000-0001-9653-1583
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2019 (English)In: International Paper Physics Conference 2019: preprint proceedings, TAPPI Press, 2019, p. 8-13Conference paper, Published paper (Other academic)
Abstract [en]

Torsional loading with combined out-of-plane compressive loading has been studied for its viability in measurement of out-of-plane shear properties. Paperboards of two qualities were evaluated, namely paperboard A, which was a multiply, while paperboard B was a single ply. Both paperboards were produced on commercial paperboard machines. A total of 24 samples were prepared, 12 of each quality, which were tested under four different load levels. Three different out-of-plane compressive load levels were tested in addition to test without compressive load. Results have been presented from the successful tests in terms of torque versus angle of torsion and shear stress versus shear strain plots. It has been demonstrated that the technique was suitable for out-of-plane shear measurements. An order of magnitude agreement in the values of the properties was obtained in the torsional test method and the rigid block shear tests. Results indicated a possible stable post-peak response in shear loading at sample sizes that would provide material properties comparable with that of a homogeneous test. The torsional setup offered benefit of ease of applying out-of-plane axial loads, both in compression and tension.

Place, publisher, year, edition, pages
TAPPI Press, 2019. p. 8-13
Keywords [en]
paperboard, board properties, failure mode analysis, torsion test, shear stress, torque, multiply board
National Category
Paper, Pulp and Fiber Technology
Identifiers
URN: urn:nbn:se:ri:diva-43252OAI: oai:DiVA.org:ri-43252DiVA, id: diva2:1385816
Conference
International Paper Physics Conference 2019, Indianapolis, IN, USA, 5-8 May 2019; PaperCon 2019
Available from: 2020-01-15 Created: 2020-01-15 Last updated: 2020-01-30Bibliographically approved

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Nygårds, MikaelHagman, AntonPendergraph, Samuel

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