Polymer based 140 GHz Planar Gap Waveguide Array Antenna for Line of Sight (LOS) MIMO Backhaul LinksShow others and affiliations
2019 (English)In: IMWS-AMP 2019 - 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, Institute of Electrical and Electronics Engineers Inc. , 2019, p. 148-150Conference paper, Published paper (Refereed)
Abstract [en]
This paper presents the micromachining based fabrication process of a 140 GHz planar antenna array based on gap waveguide technology to be used in next generation backhauling links. Each antenna element in the bigger 3D-array to be used in LOS MIMO configuration designed to have about 30dBi gain. Each antenna element in the big array consists of several metal layers such as the cavity backed radiation layer and a corporate feed network layer. In this work, we focus on the single antenna array element. Considering some fabrication difficulties as well as focusing on batch fabrication, three different micromachine techniques, SU8 fabrication, PDMS molding and injection molding of polymer OSTEMER has been utilized to fabricate the single antenna device.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2019. p. 148-150
Keywords [en]
injection molding, LOS MIMO, PDMS, planar antenna, SU8, Fabrication, Microchannels, Network layers, Pulse width modulation, Waveguides, Antenna element, Backhaul links, Batch fabrication, Corporate feed network, Fabrication process, Planar antenna arrays, Planar antennas, Single antenna, Antenna arrays
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-40873DOI: 10.1109/IMWS-AMP.2019.8880101Scopus ID: 2-s2.0-85075039901ISBN: 9781728109350 (print)OAI: oai:DiVA.org:ri-40873DiVA, id: diva2:1376857
Conference
5th IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2019, 16 July 2019 through 18 July 2019
Note
Funding text 1: ACKNOWLEDGEMENT Strategic program ″Smartare Elektroniksystem″ by Vinnova and Swedish Energy Agency is acknowledged for this project.
2019-12-102019-12-102023-06-08Bibliographically approved