Application of EIS and SKP methods for the study of the zinc/polymer interface
2008 (English)In: Electrochimica Acta, ISSN 0013-4686, E-ISSN 1873-3859, Vol. 53, no 25, p. 7531-7538Article in journal (Refereed) Published
Abstract [en]
Electrochemical impedance spectroscopy (EIS) and Scanning Kelvin probe (SKP) were applied to study the zinc/polymer interface. The coating capacitance and the drop of potential across the zinc/epoxy interface are investigated as a function of water penetration and hydrolysis of adhesion bonds. Water penetrates to the interface, decreasing thus the potential drop and increasing the capacitance. Further removal of water leads to the restoration of bonds accompanied by a decrease in capacitance and the return to the initial potential distribution across the interface. Commercial high-performance coil coatings applied to galvanized steel were studied in order to correlate the interface stability and the tendency to blistering. EIS and SKP measurements allowed the evaluation of the electrochemical conditions at the interface. Local adhesion failures caused non-uniformity in the potential profile measured by SKP. Monitoring of changes in impedance at low frequency related to the interface during temperature cycling may be useful for the evaluation of the tendency to blistering.
Place, publisher, year, edition, pages
2008. Vol. 53, no 25, p. 7531-7538
Keywords [en]
Blistering, Capacitance, Hydrothermal stress, Metal-polymer interfaces, Volta potential, Adhesion, Cladding (coating), Dewatering, Drops, Electrochemical corrosion, Fluid mechanics, Galvanized metal, Galvanizing, Iron, Adhesion bonds, Coating capacitance, Coil coatings, Electrochemical conditioning, Electrochemical impedance spectroscopy (EIS), Galvanized steels, Initial potential, Interface stabilities, Local adhesion, Low frequency (LF), Non uniformities, Poten tial profile, Potential drop, Scanning Kelvin probe (SKP), Temperature cycling, Water penetration, Electrochemical impedance spectroscopy
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:ri:diva-40430DOI: 10.1016/j.electacta.2007.11.053Scopus ID: 2-s2.0-48449106120OAI: oai:DiVA.org:ri-40430DiVA, id: diva2:1361370
2019-10-162019-10-162019-10-16Bibliographically approved