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Residual stress measurement through the thickness of ball grid array microelectronics packages using incremental hole drilling
Iran University of Science and Technology, Iran.
RISE - Research Institutes of Sweden, Materials and Production, IVF.
Iran University of Science and Technology, Iran.
2019 (English)In: Microelectronics and reliability, ISSN 0026-2714, E-ISSN 1872-941X, Vol. 102, article id 113473Article in journal (Refereed) Published
Abstract [en]

Microelectronic packages typically consist of several layers of polymer, silicon, and composite materials, which are bonded together under heat and pressure. The mismatch in thermo-mechanical properties between different layers can induce significant residual stresses in the fabrication process that may lead to delamination at the interface between the bonded layers. Therefore, it is important to develop a reliable method to determine residual stresses. In this study, incremental hole drilling method was used to determine fabrication-induced residual stresses in a ball grid array (BGA) microelectronics package. First, a small hole was drilled in several steps at the center of a strain gauge rosette bonded to the surface of the BGA package. This released residual stresses trapped at each depth increment and deformed the component. The corresponding surface strains were measured in three directions using rosette gauges. Then, the residual stress was calculated based on the integral method, in which the measured strains are converted to the residual stresses using a calibration matrix whose elements are obtained from a finite element model. The three in-plane components of the residual stress through the thickness of different layers of a BGA package, including molding compound, silicon chip, die attach, and the composite substrate, were reported based on the incremental hole drilling method. These findings show that the incremental hole drilling method can be used as a reliable method to estimate the residual stresses over the entire thickness of microelectronic packages, and evaluate their effect on the reliability under service conditions.

Place, publisher, year, edition, pages
Elsevier Ltd , 2019. Vol. 102, article id 113473
Keywords [en]
Ball grid array (BGA) package, Finite element modeling, Incremental hole drilling, Residual stress, Strain gauge, Boreholes, Elasticity, Electronics packaging, Finite element method, Glass ceramics, Infill drilling, Microelectronics, Residual stresses, Strain, Strain gages, Ball grid array packages, Composite substrate, Hole drilling, Incremental hole drilling method, Microelectronic package, Microelectronics packages, Strain gauge rosette, Thermomechanical properties, Ball grid arrays
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-39843DOI: 10.1016/j.microrel.2019.113473Scopus ID: 2-s2.0-85070860555OAI: oai:DiVA.org:ri-39843DiVA, id: diva2:1356530
Available from: 2019-10-01 Created: 2019-10-01 Last updated: 2019-10-01Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
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More styles
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  • nn-NB
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  • Other locale
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