Blister propagation in sandwich panels
2019 (English)In: Journal of Sandwich Structures and Materials, ISSN 1099-6362, E-ISSN 1530-7972, Vol. 21, no 5, p. 1683-1699Article in journal (Refereed) Published
Abstract [en]
This paper deals with the problem of face/core interfacial disbonds in sandwich panels that are pressurised, i.e. the disbond has an initial fluid pressure that causes the disbond to deform. The problem is often referred to as a blister. The panel with a blister is then subjected to an in-plane compressive load. Four different panels are analysed and tested, having different size disbonds and different initial internal pressure. The cases are analysed using a finite element approach where the blister is modelled using fluid elements enabling the pressure inside the blister to vary as the in-plane load is applied. The analysis uses non-linear kinematics, and in each load step, the energy release rate is calculated along the disbond crack front. This model is used for failure load predictions. The four cases are then tested experimentally by filling a pre-manufactured disbond cavity with a prescribed volume of air. This air volume is then entrapped, and the panel is subjected to an in-plane compressive load. The load and blister pressures are measured throughout the test and compared with the finite element analysis. Surface strains and blister deformations are also measured using digital correlation measurements. The predicted failure loads compare well with the experimental results, and so does the blister pressures, the latter at least qualitatively. © The Author(s) 2019.
Place, publisher, year, edition, pages
SAGE Publications Ltd , 2019. Vol. 21, no 5, p. 1683-1699
Keywords [en]
blister, Delamination, experimental, numerical, Honeycomb structures, Sandwich structures, Compressive loads, Digital correlation, Failure load prediction, Finite-element approach, Initial internal pressure, Finite element method
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-39457DOI: 10.1177/1099636219838038Scopus ID: 2-s2.0-85067665443OAI: oai:DiVA.org:ri-39457DiVA, id: diva2:1335985
2019-07-082019-07-082023-05-16Bibliographically approved