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25-Gb/s transmission over 2.5-km SSMF by silicon MRR enhanced 1.55-μm III-V/SOI DML
DTU Technical University of Denmark, Denmark.
DTU Technical University of Denmark, Denmark.
RISE - Research Institutes of Sweden, ICT, Acreo.ORCID iD: 0000-0001-9839-7488
University of Rennes 1, France.
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2017 (English)In: 30th Annual Conference of the IEEE Photonics Society, IPC 2017, Institute of Electrical and Electronics Engineers Inc. , 2017, p. 357-360Conference paper, Published paper (Refereed)
Abstract [en]

The use of a micro-ring resonator (MRR) to enhance the modulation extinction ratio and dispersion tolerance of a directly modulated laser (DML) is experimentally investigated with a bit rate of 25 Gb/s as proposed for the next generation data center communications. The investigated system combines a 11-GHz 1.55-m directly modulated hybrid III-V/SOI DFB laser realized by bonding III-V materials (InGaAlAs) on a silicon-on-insulator (SOI) wafer and a silicon MRR also fabricated on SOI. Such a transmitter enables error-free transmission (BER< 10 -9 )at 25 Gb/s data rate over 2.5-km SSMF without dispersion compensation nor forward error correction (FEC). As both laser and MRR are fabricated on the SOI platform, they could be combined into a single device with enhanced performance, thus providing a cost-effective transmitter for short reach applications.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2017. p. 357-360
Keywords [en]
Optical transmitters, Photonic integrated circuits, Resonators f Iters, Aluminum compounds, Cost effectiveness, Distributed feedback lasers, Error compensation, Error correction, Gallium compounds, Hybrid materials, Indium compounds, Optical communication, Optical resonators, Photonics, Resonators, Silicon, Silicon on insulator technology, Transmitters, Wafer bonding, Directly modulated lasers, Dispersion tolerance, Error free transmission, Forward error corrections (FEC), Microring Resonator (MRR), Next generation data centers, Silicon on insulator wafers, Silicon wafers
National Category
Computer Systems
Identifiers
URN: urn:nbn:se:ri:diva-38044DOI: 10.1109/IPCon.2017.8116138Scopus ID: 2-s2.0-85043470774ISBN: 9781509065783 (print)OAI: oai:DiVA.org:ri-38044DiVA, id: diva2:1297108
Conference
30th Annual Conference of the IEEE Photonics Society, IPC 2017, 1 October 2017 through 5 October 2017
Available from: 2019-03-19 Created: 2019-03-19 Last updated: 2019-03-20Bibliographically approved

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  • apa
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