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Application of Assaf panel for evaluating throwing power of pulse reverse electroplating on complex geometries
RISE - Research Institutes of Sweden, Safety and Transport, Electronics. Jönköping University, Sweden.ORCID iD: 0000-0002-7095-1907
Jönköping University, Sweden.
2018 (English)In: Transactions of the Institute of Metal Finishing, ISSN 0020-2967, E-ISSN 1745-9192, Vol. 96, no 5, p. 258-264Article in journal (Refereed) Published
Abstract [en]

The Assaf panel arrangement was used for evaluating pulse reverse plating processes and optimisation of the throwing power (TP) of complex three-dimensional (3D) geometries. Two different electroplating processes were investigated: an acid copper bath and a cyanide silver bath without additives. It has not been possible to establish a direct correlation factor for TP obtained with the Assaf panel and the 3D objects included in the trials. Nevertheless, the Assaf panel was found to be a useful tool for preliminary process parameter optimisation. The copper bath needs agitation to deposit coatings of good quality, whereas the silver bath obtains the best throwing power without agitation. The latter is probably due to inhibition by adsorbed cyanide.

Place, publisher, year, edition, pages
2018. Vol. 96, no 5, p. 258-264
Keywords [en]
copper, pulse reverse, silver, Throwing power, Cyanides, Complex geometries, Correlation factors, Electroplating process, Process parameters, Pulse reverse plating, Three-dimensional (3D) geometry, Electroplating
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-35202DOI: 10.1080/00202967.2018.1507331Scopus ID: 2-s2.0-85053235016OAI: oai:DiVA.org:ri-35202DiVA, id: diva2:1254852
Available from: 2018-10-10 Created: 2018-10-10 Last updated: 2019-03-06Bibliographically approved

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Leisner, Peter

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