Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring Joints
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-9505-0822
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-8556-0925
2018 (English)Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2018. p. 882-889, article id 8429649
National Category
Other Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-34837DOI: 10.1109/ECTC.2018.00136Scopus ID: 2-s2.0-85048853670OAI: oai:DiVA.org:ri-34837DiVA, id: diva2:1239053
Conference
ECTC Conference, May 29 – June 1, San Diego
Available from: 2018-08-15 Created: 2018-08-15 Last updated: 2019-03-07Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Lövberg, AndreasTegehall, Per-Erik

Search in DiVA

By author/editor
Lövberg, AndreasTegehall, Per-Erik
By organisation
Swerea IVF
Other Natural Sciences

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 93 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf