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Experimental and CFD evaluation of active anti-condensation methods for non-hermetic cabinets
Jönköping University, Sweden.
Jönköping University, Sweden.
Omnisys Instruments AB, Sweden.
Saab AB, Sweden.
Show others and affiliations
2018 (English)In: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, p. 1-6Conference paper, Published paper (Refereed)
Abstract [en]

Experimental evaluation of several active anti-condensation methods for application in non-hermetic electronics enclosures was performed in harsh climatic conditions, including RH = 70% and T = 43 °C. The studied methods included blowing the air along the exposed surface, combination of blowing and air heating as well as local heating of the exposed surface in natural convection conditions. The purpose was to prevent/remove the dew on/from the exposed surface of a micro-condensation sensor. The difference between the methods was quantified in terms of time for dew removal. The power consumption aspects were discussed. A CFD based optimization methodology was developed to determine the heating profiles for the local anti-condensation PCB heater in a non-hermetic cabinet exposed to the quickly changing climatic conditions. The potential for 60% energy savings was revealed by simulation.

Place, publisher, year, edition, pages
2018. p. 1-6
Keywords [en]
computational fluid dynamics, condensation, electronics packaging, heating, natural convection, microcondensation sensor, CFD based optimization methodology, nonhermetic cabinet, active anti-condensation methods, natural convection conditions, air heating, temperature 43.0 degC, Heating systems, Surface treatment, Humidity, Plastics, Electron tubes, Temperature measurement, Bars
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-34345DOI: 10.1109/EuroSimE.2018.8369863Scopus ID: 2-s2.0-85048877385OAI: oai:DiVA.org:ri-34345DiVA, id: diva2:1236932
Conference
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Available from: 2018-08-06 Created: 2018-08-06 Last updated: 2019-01-08Bibliographically approved

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Leisner, Peter

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
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