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Methods for characterization of wafer-level encapsulation applied on Si to LTCC Anodic bonding
Khan, MF
Ghavanini, FA
Haasl, Sjoerd
ORCID iD:
0000-0002-9327-2544
Löfgren, L
Persson, K
RISE, Swedish ICT, Acreo.
Rusu, C
RISE, Swedish ICT, Acreo.
Schjälberg-Henriksen, K
Enoksson, P
Show others and affiliations
2010 (English)
In:
J. Micromech. Microeng., Vol. 20, p. 64020-
Article in journal (Refereed) Published
Place, publisher, year, edition, pages
2010. Vol. 20, p. 64020-
National Category
Computer and Information Sciences
Identifiers
URN:
urn:nbn:se:ri:diva-32075
OAI: oai:DiVA.org:ri-32075
DiVA, id:
diva2:1151934
Available from:
2017-10-24
Created:
2017-10-24
Last updated:
2023-06-08
Bibliographically approved
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Haasl, Sjoerd
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modern-language-association-8th-edition
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