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Printed Glass for Anodic Bonding - A Packaging Concept for MEMS System On a Chip
RISE, Swedish ICT, Acreo.
2002 (English)In: Advancing Microelectronics, Vol. 29, no 1Article in journal (Refereed) Published
Place, publisher, year, edition, pages
2002. Vol. 29, no 1
National Category
Computer and Information Sciences
Identifiers
URN: urn:nbn:se:ri:diva-31990OAI: oai:DiVA.org:ri-31990DiVA, id: diva2:1151848
Available from: 2017-10-24 Created: 2017-10-24 Last updated: 2020-12-01Bibliographically approved

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