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Simulation-driven packaging of proof of concept thermoelectric modules: Proceedings of SMTA PanPacific Microelectronics Symposium 2014
Brinkfeldt, Klas
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
ORCID iD:
0000-0002-6483-8924
Edwards, Michael
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
Andersson, Dag
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
ORCID iD:
0000-0002-2232-7835
Simon, J
Noël, S
Romanjek, K
Show others and affiliations
2014 (English)
In:
Proceedingsof SMTA Pan Pacific Microelectronics Symposium 2014, 2014
Conference paper, Oral presentation with published abstract (Other academic)
Place, publisher, year, edition, pages
2014.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN:
urn:nbn:se:ri:diva-31233
OAI: oai:DiVA.org:ri-31233
DiVA, id:
diva2:1141011
Conference
SMTA Pan Pacific Microelectronics Symposium 2014, Hapuna Beach, HI, USA, February 11-13.
Available from:
2017-09-13
Created:
2017-09-13
Last updated:
2023-05-16
Bibliographically approved
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Andersson, Dag
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ieee
modern-language-association-8th-edition
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apa
ieee
modern-language-association-8th-edition
vancouver
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de-DE
en-GB
en-US
fi-FI
nn-NO
nn-NB
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