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Simulation-driven packaging of proof of concept thermoelectric modules: Proceedings of SMTA PanPacific Microelectronics Symposium 2014
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-6483-8924
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-2232-7835  
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2014 (English)In: Proceedingsof SMTA Pan Pacific Microelectronics Symposium 2014, 2014Conference paper, Oral presentation with published abstract (Other academic)
Place, publisher, year, edition, pages
2014.
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Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:ri:diva-31233OAI: oai:DiVA.org:ri-31233DiVA: diva2:1141011
Conference
SMTA Pan Pacific Microelectronics Symposium 2014, Hapuna Beach, HI, USA, February 11-13.
Available from: 2017-09-13 Created: 2017-09-13 Last updated: 2017-09-15Bibliographically approved

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