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Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.
RISE - Research Institutes of Sweden, ICT, Acreo.
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.
KTH Royal Institute of Technology, Sweden.
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2017 (English)In: 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, 2017Conference paper, Published paper (Refereed)
Abstract [en]

In typical press-pack, free-floating packages the thermal contact resistance between chip and substrate is a major limiting factor for the cooling ability of the power module. We report an introduction of a new, thin Silver interlayer between Molybdenum substrate and chip, and how it improves the thermal contact. The thermal contact resistances were measured with and without a Silver interlayer at different pressures. The surface roughness of the SiC chip and the Molybdenum substrate were characterized. The thermal contact resistances were measured at three different heating power levels. The results show a significant reduction of the thermal contact resistance with only a few micrometer Silver interlayer. The improved cooling effect of a Silver interlayer was also demonstrated with a fluid dynamics type of 3 D simulation comparing temperature distributions with and without a Silver interlayer. These results project a possible thermal improvement in press-pack packages.

Place, publisher, year, edition, pages
2017.
Keyword [en]
interlayer, Molybdenum, packaging, press-pack, pressure dependence, Silicon Carbide, Silver, thermal contact resistance, Contact resistance, Presses (machine tools), Substrates, Surface roughness, Thermal conductivity of solids, Different pressures, Molybdenum substrate, Press pack, Silicon carbide chips, Silver interlayers, Chip scale packages
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-30902DOI: 10.1109/IWIPP.2017.7936753Scopus ID: 2-s2.0-85025660047ISBN: 9781509042784 OAI: oai:DiVA.org:ri-30902DiVA: diva2:1139380
Conference
2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, 5 April 2017 through 7 April 2017
Available from: 2017-09-07 Created: 2017-09-07 Last updated: 2017-09-07Bibliographically approved

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CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
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