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Thermomechanical Analysis and Characterization of a Press-Pack Structure for SiC Power Module Packaging Applications
RISE - Research Institutes of Sweden, ICT, Acreo.
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.
Jönköping University, Sweden.
RISE - Research Institutes of Sweden, Safety and Transport, Safety.
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2017 (English)In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 7, no 7, 1089-1100 p.Article in journal (Refereed) Published
Abstract [en]

This paper presents an experimental methodology for the characterization of thermomechanical displacement and friction properties in a free-floating press-pack structure, and evaluation of the tensile stress on the semiconductor die through simulation of different mechanical and thermal loading conditions. The press-pack structure consists of a single silver-metallized (1 μm) silicon carbide die (400 μm) in contact with rhodium-coated (0.4 μm) molybdenum square plates. The thermomechanical displacements in the press-pack structure have been obtained using the digital image correlation technique, and the mean random error has been $± $0.1 μm, which is approximately 10 ppm of the measured length (10.5 mm). The developed experimental method has led to an analytical estimation of friction coefficients on the interfaces' silicon carbide-molybdenum and molybdenum-copper. The results demonstrate that the thin silver layer behaves as a solid film lubricant. A 2-D finite-element model representing the experimental setup has been implemented. The difference in displacement between measurement and simulation is less than 8%. Furthermore, the coinfluence of the design parameters on the thermomechanical performance of the stacked structure has been analyzed through simulations. Finally, design guidelines to reduce the tensile stress on the silicon carbide die have been proposed regarding free-floating press-pack power electronics packaging.

Place, publisher, year, edition, pages
2017. Vol. 7, no 7, 1089-1100 p.
Keyword [en]
Bars, Finite-element (FE) analysis, Friction, measurement techniques, Multichip modules, optical imaging, power electronics, Silicon carbide, stress, Temperature measurement, thermal expansion., Thermomechanical processes, Bars (metal), Carbide dies, Electronics packaging, Finite element method, Molybdenum, Silicon, Silver, Stress analysis, Stresses, Structural design, Tensile stress, Thermal expansion, Tribology, Wide band gap semiconductors, Digital image correlation technique, Experimental methodology, Measurement and simulation, Thermo-mechanical analysis, Thermo-mechanical performance, Thermomechanical process, Presses (machine tools)
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Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-30870DOI: 10.1109/TCPMT.2017.2711272Scopus ID: 2-s2.0-85023771342OAI: oai:DiVA.org:ri-30870DiVA: diva2:1138990
Available from: 2017-09-06 Created: 2017-09-06 Last updated: 2017-09-06Bibliographically approved

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