Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Double sided bulk micromachining of SOI films using room temperature oxygen plasma assisted bonding,
RISE, Swedish ICT, SICS, Imego.
RISE, Swedish ICT, SICS, Imego.ORCID iD: 0000-0001-6637-9859
2002 (English)In: Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002), 2002Conference paper (Refereed)
Place, publisher, year, edition, pages
2002.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:ri:diva-25201DOI: 10.1117/12.462867OAI: oai:DiVA.org:ri-25201DiVA, id: diva2:1132646
Available from: 2018-07-02 Created: 2016-10-31 Last updated: 2018-07-19Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full text

Authority records BETA

Andersson, Gert

Search in DiVA

By author/editor
Andersson, Gert
By organisation
Imego
Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
v. 2.35.2