Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Current problems and possible solutions in high-temperature lead-free soldering
Institute of Physics of Materials, AS CR.
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-2232-7835  
ITRI Ltd.
ITRI Ltd.
Show others and affiliations
2012 (English)In: Journal of materials engineering and performance (Print), ISSN 1059-9495, E-ISSN 1544-1024, Vol. 21, no 5, 629-637 p.Article in journal (Refereed) Published
Abstract [en]

The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M≈220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M≈250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions for production of reliable lead-free joints for high-temperature applications.

Place, publisher, year, edition, pages
2012. Vol. 21, no 5, 629-637 p.
Keyword [en]
Current drives, Current situation, High temperature, Intensive research, Lead-Free, Lead-free soldering, Low costs, Possible solutions, Viable solutions, Electronics industry, Manufacture, Soldering alloys, Soldering
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:ri:diva-30184DOI: 10.1007/s11665-012-0125-3Scopus ID: 2-s2.0-84862182829OAI: oai:DiVA.org:ri-30184DiVA: diva2:1129467
Available from: 2017-08-03 Created: 2017-08-03 Last updated: 2017-08-03Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus

Search in DiVA

By author/editor
Andersson, Dag
By organisation
Swerea IVF
In the same journal
Journal of materials engineering and performance (Print)
Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

Altmetric score

Total: 4 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
v. 2.27.0