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Impact of Humidity andContamination on Surface Insulation Resistance and Electrochemical Migration
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-8556-0925
2011 (English)In: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues ofLead-Free Solder Interconnects / [ed] Grossmann, G√ľnter, Zardini, Christian, London: Springer, 2011, p. 227-254Chapter in book (Refereed)
Abstract [en]

Many electronics products are used in humid environments. High humidity in combination with various contaminants will affect the surface insulation resistance on printed board assemblies and may cause current leakage or in worse case short circuit due to electrochemical migration. This chapter discusses the failure mechanism for electrochemical migration and how it is affected by common contaminants on assemblies. Test methods for measuring surface insulation resistance and for assessing the risk for electrochemical migration are reviewed, and their relevance is discussed.

Place, publisher, year, edition, pages
London: Springer, 2011. p. 227-254
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Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:ri:diva-30155DOI: 10.1007/978-0-85729-236-0_10ISBN: 978-0-85729-235-3 (print)OAI: oai:DiVA.org:ri-30155DiVA, id: diva2:1129115
Available from: 2017-08-01 Created: 2017-08-01 Last updated: 2017-08-01Bibliographically approved

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Tegehall, Per-Erik
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