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Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to ElectrolessNickel/Immersion Gold
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-8556-0925
2011 (English)In: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects / [ed] Grossmann, Günter, Zardini, Christian, London: Springer, 2011, 179-196 p.Chapter in book (Refereed)
Abstract [en]

Solder joints to solder lands plated with electroless nickel and immersion gold are prone to fractures in the interface between the solder and the nickel surface. A common cause for these fractures has been a plating defect in the solder land coating called “black pad”. However, solder joints to solder lands plated with electroless nickel are inclined to fractures even if the black pad defect is not present. The causes of the black pad defect and the mechanisms for the increased inclination for fractures in solder joints to electroless nickel are discussed. Test methods for detecting black pad defects and assessing the risk for fractures in the solder joints are also described.

Place, publisher, year, edition, pages
London: Springer, 2011. 179-196 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:ri:diva-30154DOI: 10.1007/978-0-85729-236-0_8ISBN: 978-0-85729-235-3 (print)OAI: oai:DiVA.org:ri-30154DiVA: diva2:1129112
Available from: 2017-08-01 Created: 2017-08-01Bibliographically approved

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Tegehall, Per-Erik
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