Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components 2017 (English)Conference paper, Published paper (Other academic)

Abstract [en]

The microstructure of lead-free solder joints often consists of only one or a few randomly oriented tin grains as a result of a large degree of undercooling during solidification. Due to the severe anisotropy of single crystal Sn and the random nature of the microstructure, the stress state and microstructural evolution of each joint will be unique.

Place, publisher, year, edition, pages

Institute of Electrical and Electronics Engineers Inc. , 2017. article id 7926289

Keywords [en]

Crystal microstructure, Lead-free solders, Microelectronics, Microstructure, Microsystems, Single crystals, Soldered joints, Tin, Undercooling, Lead-free solder joint, Stress state

National Category

Electrical Engineering, Electronic Engineering, Information Engineering

Identifiers

URN: urn:nbn:se:ri:diva-30148DOI: 10.1109/EuroSimE.2017.7926289Scopus ID: 2-s2.0-85020212288OAI: oai:DiVA.org:ri-30148DiVA, id: diva2:1128957

Conference

EuroSimE 2017, 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Available from: 2017-07-31 Created: 2017-07-31 Last updated: 2023-05-16Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Andersson, Dag

Search in DiVA

By author/editor

Tegehall, Per-ErikBrinkfeldt, KlasAndersson, Dag

By organisation

Swerea IVFElektronikhårdvara

On the subject

Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle ScholarTotal: 54 hits