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Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.ORCID iD: 0000-0002-8556-0925
RISE - Research Institutes of Sweden, Swerea, Swerea IVF.
RISE - Research Institutes of Sweden, Swerea, Swerea IVF, Elektronikhårdvara.ORCID iD: 0000-0002-6483-8924
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2017 (English)Conference paper, (Other academic)
Abstract [en]

The microstructure of lead-free solder joints often consists of only one or a few randomly oriented tin grains as a result of a large degree of undercooling during solidification. Due to the severe anisotropy of single crystal Sn and the random nature of the microstructure, the stress state and microstructural evolution of each joint will be unique.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2017. 7926289
Keyword [en]
Crystal microstructure, Lead-free solders, Microelectronics, Microstructure, Microsystems, Single crystals, Soldered joints, Tin, Undercooling, Lead-free solder joint, Stress state
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:ri:diva-30148DOI: 10.1109/EuroSimE.2017.7926289OAI: oai:DiVA.org:ri-30148DiVA: diva2:1128957
Conference
EuroSimE 2017, 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Available from: 2017-07-31 Created: 2017-07-31 Last updated: 2017-07-31Bibliographically approved

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Tegehall, Per-ErikBrinkfeldt, KlasAndersson, Dag
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