Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Reliability of Microtechnology: Interconnects, Devices and Systems
Chalmers University of Technology.
Nokia Siemens Networks.
Nokia Siemens Networks.
Portland State University.
Show others and affiliations
2011 (English)Book (Other academic)
Place, publisher, year, edition, pages
Springer-Verlag New York, 2011.
Keywords [en]
Electronics and Microelectronics, Instrumentation, Optical Materials, Electronic Materials, Quality Control, Reliability, Safety and Risk, Nanotechnology, Microengineering
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:ri:diva-30139DOI: 10.1007/978-1-4419-5760-3ISBN: 978-1-4419-5759-7 (print)ISBN: 978-1-4419-5760-3 (electronic)OAI: oai:DiVA.org:ri-30139DiVA, id: diva2:1128878
Available from: 2017-07-31 Created: 2017-07-31Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full text

Search in DiVA

By author/editor
Tegehall, Per-Erik
By organisation
Swerea IVF
Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 5 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
v. 2.34.0