Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Evolution of viscoelastic behaviour of a curing LY5052 epoxy resin in the rubbery state
RISE - Research Institutes of Sweden, Swerea, Swerea SICOMP.
RISE - Research Institutes of Sweden, Swerea, Swerea SICOMP.
Luleå Technical Univ., Lulea, Sweden.
2017 (English)In: Advanced Composite Materials, ISSN 0924-3046, E-ISSN 1568-5519Article in journal (Refereed) In press
Abstract [en]

In this work, we investigate the relationship between the rubbery modulus and the degree of cure for partially to fully cured LY5052 epoxy resin. In particular, this paper experimentally tests an existing model formulated for shear modulus by redefining for in the tensile storage modulus. Experiments to characterize viscoelastic behaviour were performed in a dynamic mechanical and thermal analysis (DMTA) instrument in the frequency domain. Master curves are then created from DMTA using general time–temperature–cure superposition. The master curves are then normalized using the model so that the master curve does not depend on the properties in the rubbery region. This results in a unique master curve that describes the viscoelastic behaviour of the LY5052 epoxy resin for the given conditions. Once the relationship between the rubbery modulus and the degree of cure has been established, the amount of experimental characterization can be reduced. This could lead to the development of simplified experimental methodologies and simplified models to characterize the viscoelasticity of low molecular weight resins like the LY5052 epoxy resin system.

Place, publisher, year, edition, pages
2017.
Keyword [en]
curing, mechanical properties, thermal analysis, thermosetting resin, Dynamic mechanical analysis, Elastic moduli, Frequency domain analysis, Thermoanalysis, Thermosets, Viscoelasticity, Degree of cure, Dynamic mechanical, Epoxy resin system, Experimental characterization, Experimental methodology, Frequency domains, Low molecular weight resin, Viscoelastic behaviour, Epoxy resins
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-29321DOI: 10.1080/09243046.2017.1310076Scopus ID: 2-s2.0-85017361024OAI: oai:DiVA.org:ri-29321DiVA: diva2:1095120
Available from: 2017-05-12 Created: 2017-05-12 Last updated: 2017-05-12Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus
By organisation
Swerea SICOMP
In the same journal
Advanced Composite Materials
Natural Sciences

Search outside of DiVA

GoogleGoogle Scholar

Altmetric score

Total: 5 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
v. 2.28.0