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COPGLOW and XPS investigation of recycled metal powder for selective laser melting
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.
Chalmers, Gothenburg, Sweden.
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.
RISE - Research Institutes of Sweden, Swerea, Swerea KIMAB.
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2017 (English)In: Powder Metallurgy, ISSN 0032-5899, E-ISSN 1743-2901Article in journal (Refereed) In press
Abstract [en]

The purpose of this paper is to compare, in terms of depth composition profile, a recycled hastelloy X powder and a virgin powder of the same alloy. We compare also the COPGLOW (compacted powder glow discharge analysis) method to the more established XPS (X-ray photoelectron spectroscopy) technique, in terms of similarity in reported elemental contents. A good match between the two methods was obtained on the surface of the powder particles (using an etching depth of 1 nm). Similar oxide layer thickness, of about 0.5–1 nm, was found on both powders by COPGLOW. Oxidation sensitive elements, such as Cr, were found on the surfaces by both XPS and COPGLOW on both powders. Surface content of Si appears to have decreased during use in selective laser melting. Finally, the two methods did not otherwise reveal any unexpected features in the depth profiles.

Place, publisher, year, edition, pages
2017.
Keyword [en]
Additive manufacturing, compacted powder glow discharge analysis, depth composition profile, hastelloy X, metal powder, X-ray photoelectron spectroscopy, 3D printers, Glow discharges, Melting, Photoelectrons, Photons, Powders, Recycling, X ray photoelectron spectroscopy, Composition profile, Discharge analysis, Elemental contents, Oxide layer thickness, Powder particles, Selective laser melting, Sensitive elements, Powder metals
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-29336DOI: 10.1080/00325899.2017.1296607ScopusID: 2-s2.0-85015030595OAI: oai:DiVA.org:ri-29336DiVA: diva2:1093930
Available from: 2017-05-08 Created: 2017-05-08 Last updated: 2017-05-08Bibliographically approved

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