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Thermal evaluation of a liquid/air cooled integrated power inverter for hybrid vehicle applications
RISE, Swedish ICT, Acreo. Jönköping University, Sweden; KTH Royal Institute of Technology, Sweden.
Jönköping University, Sweden.
RISE, SP – Sveriges Tekniska Forskningsinstitut.
Jönköping University, Sweden.ORCID iD: 0000-0002-9512-2689
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2014 (English)In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, 2014, , p. 6529944article id 6529944Conference paper, Published paper (Refereed)
Abstract [en]

A thermal design of an integrated double-side cooled SiC 50kW-1200V-200A power inverter for hybrid electric vehicle applications has been proposed to enable cooling in two different automotive operating environments: under-hood and controlled temperature environment of passenger compartment. The power inverter is integrated with air/liquid cooled cold plates equipped with finned channels. Concept evaluation and CFD model calibration have been performed on a simplified thermal prototype. Computational experiments on the detailed model of the inverter, including packaging materials, have been performed for automotive industry defined application scenarios, including two extreme and one typical driving cycles. For the studied applicationscenarios the case temperature of the SiC transistors and diodes have been found to be below 210°C. The maximum steady-state temperature of the DC-link capacitor has been below 127 °C for the worst-case scenario including liquid cooling, and up to 140 °C for the worst-case scenario with air-cooling.

Place, publisher, year, edition, pages
2014. , p. 6529944article id 6529944
Keywords [en]
Automotive industry, Experiments, Hybrid vehicles, Microelectronics, Microsystems, Packaging materials, Silicon carbide
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-12482DOI: 10.1109/EuroSimE.2013.6529944Scopus ID: 2-s2.0-84880987018Local ID: 23803OAI: oai:DiVA.org:ri-12482DiVA, id: diva2:970306
Conference
14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013; Wroclaw; Poland; 14 April 2013 through 17 April 2013
Available from: 2016-09-13 Created: 2016-09-13 Last updated: 2024-02-06Bibliographically approved

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Bakowski, MietekLeisner, Peter

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