Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Investigation of a finned baseplate material and thickness variation for thermal performance of a SiC power module
RISE - Research Institutes of Sweden (2017-2019), ICT, Acreo. Jönköping University, Sweden; KTH Royal Institute of Technology, Sweden.
Jönköping University, Sweden.
RISE - Research Institutes of Sweden (2017-2019), ICT, Acreo.ORCID iD: 0000-0002-9512-2689
RISE - Research Institutes of Sweden (2017-2019), ICT, Acreo.ORCID iD: 0000-0002-9850-9440
Show others and affiliations
2014 (English)In: 15th international conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, IEEE , 2014, , p. 1-8article id 6813817Conference paper, Published paper (Refereed)
Abstract [en]

A simplified transient computational fluid dynamics model of an automotive three-phase double-side liquid cooled silicon carbide power inverter, including pin-fin baseplates, has been developed and qualified for parametric studies. Effective heat transfer coefficients have been extracted from the detailed pin-fin baseplate model for two coolant volume flow rates 2 l/min and 6 l/min, at the coolant temperature 105 °C. The inverter model includes temperature dependent heat losses of SiC transistors and diodes, calculated for two driving cycles. Baseplate materials such as copper, aluminum-silicon carbide metal matrix composite, aluminium alloy 6061 as well as virtual materials have been evaluated in the parametric studies. Thermal conductivity, specific heat and density have been varied as well as thickness of the finned baseplates (1 to 3 mm). A trade-off between temperature of SiC chips and baseplate weight has been investigated by means of Pareto optimization. The main results of the parametric studies include a weak dependence (1 to 3 °C) of the chip temperature on baseplate thickness. Furthermore, switching e.g. between copper and AlSiC results in 5 to 8 °C increase of the chip temperature, at 65 to 70 % baseplate weight reduction.

Place, publisher, year, edition, pages
IEEE , 2014. , p. 1-8article id 6813817
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-12451DOI: 10.1109/EuroSimE.2014.6813817Scopus ID: 2-s2.0-84901397486Local ID: 23636OAI: oai:DiVA.org:ri-12451DiVA, id: diva2:970275
Conference
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014. 15th international conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Ghent
Available from: 2016-09-13 Created: 2016-09-13 Last updated: 2024-04-08Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Bakowski, MietekLim, Jang-KwonLeisner, Peter

Search in DiVA

By author/editor
Bakowski, MietekLim, Jang-KwonLeisner, Peter
By organisation
AcreoSP Elektronik
Natural Sciences

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 16 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf