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CFD aided reflow oven profiling for PCB preheating in a soldering process
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.ORCID iD: 0000-0002-7095-1907
2007 (English)In: Proc. of the 8th Int. Conference EurSimE 2007, 2007, , p. 535-542Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2007. , p. 535-542
National Category
Natural Sciences
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URN: urn:nbn:se:ri:diva-11757Local ID: 9004OAI: oai:DiVA.org:ri-11757DiVA, id: diva2:969579
Conference
8th Int. Conference EurSimE 2007 London, UK 16-18 april, 2007
Available from: 2016-09-13 Created: 2016-09-13 Last updated: 2020-12-01Bibliographically approved

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Leisner, Peter

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