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A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads
Saab, Sweden.
Jönköping University, Sweden.
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Sveriges tekniska forskningsinstitut, SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh).ORCID iD: 0000-0001-7182-0872
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik. Jönköping University, Sweden.ORCID iD: 0000-0002-7095-1907
2014 (English)In: Engineering computations, ISSN 0264-4401, E-ISSN 1758-7077, Vol. 31, no 3, p. 467-489, article id 17110717Article in journal (Refereed) Published
Abstract [en]

Purpose-The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature environment. A procedure to implement the method is suggested, and a discussion of the method and its possible applications is provided in the paper. Design/methodology/approach- Methodologically, interpolated response surfaces based on specially designed finite element (FE) simulation runs, are employed to compute a damage metric at regular time intervals of an operating temperature profile. The developed method has been evaluated on a finite-element model of a lead-free PBGA256 package, and accumulated creep strain energy density has been chosen as damage metric. Findings-The method has proven to be two orders of magnitude more computationally efficient compared to FE simulation. A general agreement within 3 percent has been found between the results predicted with the new method, and FE simulations when tested on a number of temperature profiles from an avionic application. The solder joint temperature ranges between +25 and +75 °C. Practical implications-The method can be implemented as part of reliability assessment of electronic packages in the design phase. Originality/value-The method enables increased accuracy in thermal fatigue life prediction of solder joints. Combined with other failure mechanisms, it may contribute to the accuracy of reliability assessment of electronic packages.

Place, publisher, year, edition, pages
2014. Vol. 31, no 3, p. 467-489, article id 17110717
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-6763DOI: 10.1108/EC-07-2012-0163Scopus ID: 2-s2.0-84901003795Local ID: 28157OAI: oai:DiVA.org:ri-6763DiVA, id: diva2:964603
Available from: 2016-09-08 Created: 2016-09-08 Last updated: 2020-12-01Bibliographically approved

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Johnson, ErlandLeisner, Peter

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