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Prognostics of Thermal Fatigue Failure of Solder Joints in Avionic Equipment
RISE, SP – Sveriges Tekniska Forskningsinstitut, SP Elektronik.ORCID iD: 0000-0002-7095-1907
2012 (English)In: IEEE Aerospace and Electronic Systems Magazine, ISSN 0885-8985, E-ISSN 1557-959X, Vol. 27, no 4, p. 16-24Article in journal (Refereed) Published
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2012. Vol. 27, no 4, p. 16-24
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URN: urn:nbn:se:ri:diva-6328DOI: 10.1109/MAES.2012.6203714Scopus ID: 2-s2.0-84861747658Local ID: 13595OAI: oai:DiVA.org:ri-6328DiVA, id: diva2:964165
Available from: 2016-09-08 Created: 2016-09-08 Last updated: 2020-12-01Bibliographically approved

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Leisner, Peter

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